晶圆减薄（晶圆抛光）GDM300_Hapoin衡鹏




晶圆减薄（晶圆抛光）GDM300特长：
·The process from back grinding to wafer mounting continuously by fully automatic system, Which enable to grind till 25um thickness.
·With 2 head polishing stage, throughput is almost double compared with 1 polish head system.
·Built in edge trimming system is available as an option for thin wafer process.
·Dual index system, which polishing stage and grinding stage is completely separated, satisfy the cleanness required for TSV and MEMS process.
·Less than Ra1A ultra luminance, ultra mirror surface is possible.



了解更多：http://www.hapoin.com/Wafer_Grinding/


晶圆减薄（晶圆抛光）GDM300相关产品：
Hapoin衡鹏供应
晶圆研磨/晶圆减薄/晶圆抛光/晶圆背抛/Wafer Grinding   GNX200BP